Electroforming Parameters: Precise "Command Rod" for Microscopic Deposition

Writer：admin Time：2024-12-26 17:08 Browse：℃

The parameters such as current density, voltage, and electroplating time during the electroplating process are like a precise "baton" in a symphony performance. They cooperate and work together to directly determine the deposition rhythm and quality of metal ions.

Current density is undoubtedly one of the most critical factors, as it controls the deposition rate of metal ions on the surface of the mold. If the current density is too high, metal ions will pile up like wild horses on the surface of the mold, forming rough, porous, or even "tree like" irregular structures, seriously damaging the appearance and internal performance of the label; On the contrary, if the current density is too low, the deposition process will become slow and sluggish, like a snail crawling. This not only reduces production efficiency, but also may lead to weak bonding between the metal layer and the mold, resulting in problems such as peeling and detachment during subsequent processing or use.

The regulation of voltage is closely related to current density, which not only affects the distribution of electric field and the migration speed of metal ions, but also needs to fully consider the polarization phenomenon of electrodes. During the electroplating process, as time passes, the state of the electrode surface changes and the polarization effect gradually increases. This requires operators to adjust the voltage according to the actual situation in a timely manner to ensure that the electroplating process proceeds smoothly in a stable and suitable electric field environment, avoiding problems such as uneven deposition and quality fluctuations caused by voltage fluctuations.

The electroplating time needs to be accurately calculated based on the required thickness of the metal layer and current density. However, in practical operation, it is not fixed because during the electroplating process, the concentration of metal ions will gradually decrease and the polarization effect of the electrode will gradually increase, all of which will affect the actual deposition rate of the metal layer. Therefore, operators need to maintain a high level of attention at all times, relying on rich experience and keen observation to dynamically adjust the electroplating time according to the progress of electroplating, ensuring that the final obtained metal layer thickness meets the predetermined requirements and the quality is stable and reliable.

After the electroplating process completes the deposition of the metal layer on the mold, the subsequent processing steps are like adding the finishing touch to an almost completed painting, transforming the electroplated label from a semi-finished product into an exquisite finished product.