‌Process Breakthroughs in Miniaturized Nickel Logos

Writer：admin Time：2025-04-01 17:22 Browse：℃

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When 3D logos shrink to millimeter scale, traditional electroforming faces challenges in demolding and structural instability. Sacrificial layer technology addresses micro-component separation—pre-coating molds with easily dissolvable metal layers, then chemically etching to release finished products.

Miniaturization demands extreme current distribution uniformity. Pulse electroforming replaces direct current, balancing ion concentration through intermittent power interruptions to prevent edge thickening from tip effects. Miniature nickel identifiers inside hearing aids rely on this technology to achieve sub-0.5mm character clarity.

Mold innovation is equally critical. Silicon-based molds produced by nanoimprint lithography reduce feature sizes to micrometer levels, enabling wafer-scale mass production through nickel electroforming and significantly lowering manufacturing costs for micro RF tags.